Tag: BGA

AOI vs. X-Ray Inspection: Which Defects Does Each Catch?

A BGA sits on a medical control board with 400 balls hidden under the body. The AOI vs X-ray inspection question stops being academic the moment a line operator waves the board past the optical camera and it passes — while a 22% void sits inside ball 137, invisible to any lens. We have watched […]

IC Local Ground Plane: EMC Routing Rules & Via Tips

Preserving a solid IC local ground plane beneath high-speed processors is one of the most effective ways to suppress EMI at the source. A 0.5 mm pitch BGA sits on your top layer, and a critical clock trace needs to reach a connector on the opposite side. Do you route directly underneath the package body to save […]

BGA Soldering: Precision Assembly Guide

Ball Grid Array (BGA) technology serves as the backbone for modern high-density electronics. Engineers rely on BGA soldering to connect advanced microprocessors and chipsets where traditional leaded packages fail. However, hidden solder joints beneath the component body introduce significant assembly complexity. Consequently, manufacturing teams must adopt precise methodologies to ensure interconnect reliability. This guide details the technical […]