Etiqueta: DFM

IC Local Ground Plane: EMC Routing Rules & Via Tips

Preserving a solid IC local ground plane beneath high-speed processors is one of the most effective ways to suppress EMI at the source. A 0.5 mm pitch BGA sits on your top layer, and a critical clock trace needs to reach a connector on the opposite side. Do you route directly underneath the package body to save […]

PCB Process Edge Design: SMT Rail Clearance Guide

A 0402 capacitor sits 2 mm from the board edge. During SMT assembly, the conveyor rail clamps down and crushes it before reflow even starts. This happens more often than you’d think. In our builds, we see this failure when designers treat the PCB process edge design as an afterthought rather than a first-order constraint. The fix […]

PCB Thermal Management: Vias and Copper Pours That Work

A MOSFET on a 5 W buck converter runs fine on the bench. Bolt it into a sealed enclosure, however, and the same part climbs past 110 °C within minutes. PCB thermal management is what separates a board that survives field use from one that cooks its own solder joints. Actually, heat is not a […]

How to Reduce PCB Assembly Cost and Enhance Efficiency: A Technical Guide

Reducing PCB assembly cost remains a primary objective for electronics manufacturers facing tight margins. However, aggressive cutting often introduces reliability risks, while pursuing speed without budget controls wastes resources. Sustainable competitiveness requires balancing expense reduction with operational efficiency. This guide details specific variables driving PCBA manufacturing expenses and outlines practical methods to optimize your workflow based on 2025 industry […]