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Sub-Assembly, Box Build & System Integration

DYC Electronic has extensive experience in the full lifecycle of manufacturing electronic products from a printed circuit assembly, through sub-assembly, and on to their final product states.

The design of DYC’s facilities, technology, processes, and resource expertise position them to optimize the quality of a client’s printed circuit assembly and box build. Achieving efficiency while maintaining flexibility and consistent quality doesn’t happen without a solid plan, team, and experience. DYC Electronic helps original equipment manufacturer (OEM) customers realize their business goals through a full suite of electronic manufacturing services.

Sub-Assembly, Box Build & System Integration

An OEM’s contract electronic assembly devices come in a myriad of sub-assembly and final assembly levels, configurations, and complexities. Leveraging diverse industry experience since 2008, DYC Electronic has a long history of industry experience to draw on when addressing an OEM’s assembly level, budget, lead time, and product fulfillment requirements.

DYC Electronic, as an electronic manufacturing services (EMS) provider, can construct printed circuit assemblies (PCA) with wire adds and integrate with electro-mechanical device levels or card slot panels. Combining these value-add solutions with a flexible order fulfillment program can result in the success of a program’s supply and production planning goals.

Box builds and complete electronic device construction are core competencies of DYC Electronic. Leveraging DYC Electronic for the assembly, testing, packaging, warehousing, and fulfillment of electronic products can help an OEM team focus on the design, marketing, and sales of their electronic products.

Assembly Types and Levels

PCA Subassemblies
Wire and Cable Harnesses
Electro-mechanical Devices and Systems
Complete Product and Device Levels
Product and System Integrations
Camera and Optical Assemblies
Ruggedized Assemblies
Motorized Assemblies
Digital, Analog and RF Assemblies
Clean Room Assemblies
High Complexity Box & System Builds
Consumer Products
Encapsulated Assemblies and Devices
Plastic and Metal Enclosed Assemblies

Manufacturing / Assembly Services

New Product Introduction (NPI)
Low and Medium Volume, High Mix
Configuration Management
Configure to Order
Build to Order
Conformal Coating, Potting and Encapsulation
Firmware Loading
Functional Testing and Quality Assurance
Product Burn In
Documentation and Packaging
Finished Goods Stocking
Third Party Logistics
Depot Repair

Certyfikaty i zgodność

Firma DYC Electronic stworzyła kompleksowy system badań i rozwoju technologii.

Certyfikat CCC
Certyfikacja systemu ISO9001:2015
Certyfikacja systemu ISO14001:2015
Certyfikacja systemu ISO13485:2016
Certyfikacja systemu IATF16949
System zarządzania łańcuchem dostaw
System śledzenia procesów MES
System zarządzania środowiskowego


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