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Why Do Vias Drag Down High-Speed Signals? Starting with Impedance — Parasitics, Stubs, and Return Path

Last Wednesday afternoon, I had a technical sync with a customer who builds servers. The board was 16 layers, 3.2 mm thick, main signals at 25G, with a few pairs running 56G. About halfway through, the SI engineer on the other side put the simulation plot on the screen and asked: for these vias that […]

Many engineers, when laying out a board, put all their attention on trace width, stackup, and impedance. But have you ever wondered one thing: why do PCB factories default to giving you 1 oz copper? If you switch to 2 oz, what exactly changes on the board? This isn’t a “thicker is better” parameter contest. […]

A few years ago, a quality incident occurred on the production line, offering a profoundly sobering lesson. A batch of PCBs with 0.4mm-pitch QFP components appeared normal during visual inspection immediately after passing through the stencil printer, yet two hours later, they all failed functional testing. Subsequent teardown analysis revealed that the component leads were […]

Thinking back, we’ve been burned before. Back in 2012 our shop took an overseas order; we asked the customer what their requirements were, and in the end we shipped the PCBA over, and the customer came back holding the IPC-A-610 standard telling us a third of the solder joints failed. Was it that our capability […]

A PCBA box build takes a finished circuit board and turns it into a product you can ship. Short answer: a box build — also called systems integration — mounts the PCBA in an enclosure, adds wiring, power, displays, and firmware, then runs a full functional test so the unit leaves the line ready to […]

A board passes design review. The paste prints, and a 0.4 mm QFP bridges on three pins. The QFN center pad traps flux gas and voids at 35 percent. None of this shows up in the schematic. It starts at the steel sheet that lays down the solder. SMT stencil design is the discipline that […]

A carton of bare boards lands on a customer’s receiving dock in July. Still, the box looks fine. Inside, one panel has a cracked corner. The pads on a second panel have dulled past their solderability window. And the bag that should have shielded the assembly turns out to be pink poly with no metal […]

A stack of bare boards arrived flat, passed incoming checks, and then bowed after the first lead-free reflow. The BGA coplanarity failed, the placement head scraped a panel, and the line stopped for two hours. PCB bow and twist is the measurement that catches this before it happens: for any board carrying surface-mount parts, IPC-A-600 […]

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